SolderStar APS - A profile for every board.
SolderStar APS
uses the latest evolution of reflow data logger to provide a full time
process monitoring solution, capable of providing a profile for every
board, in a single hardware platform.Ultrathin sensor probes are permanently
mounted along the length of the reflow oven to measure product level temperature.
This newly developed probe allows for a smaller physical size which offers
two significant advantages, fast response to changing oven loading and
the elimination of shadowing problems associated with components mounted
close to the conveyor rails.Product speed and position are monitored by
way of high accuracy real-time speed monitoring instrumentation, board-in
sensors and a new software algorithm, resulting in a 'True Profile' for
every board processed. PC software automatically calculates all important
process parameters and checks for values outside defined limits for the
process. On exit of the board from the machine this information, along
with a board ID is stored in a database for complete product traceability.Should
the measured parameters drift outside process limits then the system immediately
stops further entry of boards into the machine via a standard SMEMA interface
and alerts line staff that remedial action is required.