The lead-free challenge
• Higher reflow
temperatures
• Greater risk of heat damage to delicate components and PCBs
• Narrower processing windows
• New materials
The challenges of lead-free are considerable. In order to reflow, lead-free solders must be exposed to temperatures that are uncomfortably close to levels at which delicate components and boards can suffer irreversible heat damage.
In short, processing windows have narrowed dramatically. Compounding this, product quality, reliability, and repeatability are more important now than ever before. It’s a combination that calls for unprecedented levels of control over thermal processes. That means understanding where the temperature should be at every moment during reflow and wave soldering processes, and making sure it is achieved, and held, for the optimum dwell time.
That's where thermal profiling comes in.
• Greater risk of heat damage to delicate components and PCBs
• Narrower processing windows
• New materials
The challenges of lead-free are considerable. In order to reflow, lead-free solders must be exposed to temperatures that are uncomfortably close to levels at which delicate components and boards can suffer irreversible heat damage.
In short, processing windows have narrowed dramatically. Compounding this, product quality, reliability, and repeatability are more important now than ever before. It’s a combination that calls for unprecedented levels of control over thermal processes. That means understanding where the temperature should be at every moment during reflow and wave soldering processes, and making sure it is achieved, and held, for the optimum dwell time.
That's where thermal profiling comes in.